產品特色

Feature of product

•產品可同時貼合多層材料滿足各類客製化生產：依客戶需求，模切並貼合不同形狀與材質之產品
Theproduct can be bonded to multiple layers of materials at the same time to meet various types of customized production: according to customer needs,

die-cut and bond products of different shapes and materials.

•適用多種基材，包含雙面膠、泡棉、絕緣材料、網紗材料、功能性薄膜、金屬箔等
Applicableto a variety of substrates, including double-sided tape, foam, insulation materials, mesh materials, functional films, metal foils, etc.

•高複雜加工能力：可對不同層的基材進行模切、打洞、壓凸、排廢等加工，再貼合成高模切精度的產品

Highlycomplex processing capabilities: different layers of substrates can be die-cut, punched, embossed, and scraped, and then laminated into products with high die-cutting precision.
•高模切精度：多道工序貼合、模切後尺寸公差可控制在±0.1 mm以內
Highdie-cutting precision: multi-process lamination and post-die cutting dimensional tolerance can be controlled within ±0.1 mm

•生產效率高：模切速度最高可達50米/分，有效縮短產品交期
Highproduction efficiency: the die-cutting speed can reach up to 50 meters/minute,effectively shortening product delivery time

•具有遮罩電磁波幹擾、散熱、絕緣、防水、導電、緩衝、聲學設計音質改善、固定接著、產品防護或包覆等特殊功能，可作為手機、消費性電子產品、車用零配件或醫療設備等內部組件

Ithas special functions such as shielding electromagnetic wave interference, heat dissipation, insulation, waterproofing, conductivity, buffering, acoustic
design and sound quality improvement, fixed connection, product protection or coating, etc. It can be used as mobile phones,consumer electronics, automotive parts or medical equipment, etc. internal components

•產品運用:電腦、通訊、消費性電子等3C產業︱車用電子產業

3Cindustries such as computers, communications, and consumer electronics︱Automotiveelectronics industry